During this one-hour webinar, we will introduce ST PowerStudio, our dynamic electro-thermal simulation software for power devices supporting the SLLIMM™ (Intelligent Power Module) and ACEPACK™ (Power Module) families.
The software features a one-click comprehensive power and thermal analysis, avoiding long, complex and expensive application testing. It provides a very accurate estimation of power loss, junction and case temperatures, and even explores non-testable parameters and helps in sizing a suitable heatsink. Finally, the tool helps developers select the proper device fitting the application mission profile, saving design time and resources.
ST’s SLLIMM™ family of small low-loss intelligent molded modules enhances the efficiency of home appliance motor drives working up to 20 kHz in hard-switching circuitries and of applications with a power range up to 3 kW.
ST’s intelligent power modules (IPMs) provide a direct connection between a low-voltage microcontroller and a mains-powered electric motor. They greatly reduce costs by simplifying design and significantly reducing component count while saving space, improving reliability and lowering EMI.
Available in different package options (fully molded and DBC) , lead options (through-hole and SMD), discrete technologies (IGBT, MOSFET and SJ), current ratings and driving options, they feature the best compromise between conduction and switching losses for high efficiency, along with outstanding robustness and EMI behavior.
ST offers new ACEPACK™ 1 and ACEPACK™ 2 Power Modules with Six-pack and CIB (converter + inverter + brake) topologies in industrial power applications including industrial motor drives, solar panels, welding tools and power management solutions.
With an embedded NTC thermistor, these highly reliable power modules offer the best compromise between conduction and switching loss, maximizing the efficiency of any converter system up to 20 kHz in hard-switching circuitries for an application range from 3 to 30 kW.
ST’s power semiconductor devices offer Press-fit and additional solder options for flexible and stable mounting.
Thanks to their high configuration flexibility, these robust power modules can implement other topologies on different IGBT, MOSFET and SiC power switching applications, ensuring both a compact design and cost-effective system.
Finally, the tool helps developers select the proper device fitting the application mission profile, saving design time and resources.