Having just announced the world’s highest performing ARM® Cortex®-M-core MCU, ST had a strong presence at ARM TechCon, a premier hardware engineering and software developer event, to show it off.
The in-booth demonstration showed incorporates the energy-saving techniques that help the STM32H7 MCU series consume half the dynamic power of their predecessors in the STM32F7 series. Central to this leap in energy efficiency is ST’s own highly advanced 40nm chip-fabrication process that, in combination with innovations in the Company’s Dynamic Efficiency technologies, which allow precise optimization of power consumption.
STM32 and LoRa™
In addition to revealing the new MCU, ST also emphasized its support of wide-area-networking technologies for the Internet of Things. LoRa is a wireless communication technology developed to create the low-power, wide-area networks (LPWANs) required for machine-to-machine (M2M) and IoT applications. At the conference, ST showed its affordable and easy-to-use set of hardware tools dedicated to the evaluation and development of LoRa solutions.
The STM32 Nucleo pack for LoRa technology and high-performance FSK/OOK RF transceiver modem combined with the free LoRaWAN software expansion package for the free STM32Cube is the quickest way to build a LoRaWAN end-node device.
Below you can watch a demo of the STM32 and LoRa demo:
But ST’s ARM TechCon presence wasn’t just about demos at the show. The STM32L433 was a finalist for the ‘Best Chip Product’ as voted by UBM editors. And ST hosted 80 engineers at a hands-on training session to help them simplify cloud connectivity for embedded devices using the STM32 platform.
If you missed us or hope to join a local training session, be sure to check the ST events page to see when we will be coming to a city near you.